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High Resolution X-ray Diffraction Characterization of III-Nitride Semiconductors: Bulk Crystals and Thin Films.

机译:III型氮化物半导体的高分辨率X射线衍射特性:块状晶体和薄膜。

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摘要

As III-nitrides continue to evolve into a homoepitaxial growth scenario, the development of non-traditional metrologies for the proper study of III-nitride single crystals and homoepitaxial thin films becomes critical. To this purpose, the work presented in this dissertation has focused on the development and application of suitable high resolution X-ray diffraction (HRXRD) methods, desirable for their sensitivity, accuracy and non-destructive nature. HRXRD techniques were explored and developed for the identification of polishing-induced damage in processed III-nitride single crystals, the structural analysis of non-polar AlN homoepitaxial films grown on AlN single crystals and the assessment of alloy film characteristics of AlxGa1-xN epilayers deposited on AlN substrates.;AlN and GaN substrates were treated to various degrees of mechanical polishing and chemical mechanical polishing (CMP). Gross damage created from aggressive polishing was readily quantified using X-ray rocking curve (XRC) peak broadening and diffuse scatter intensity. However, once the wafers were exposed to CMP treatment, it was found that the use of line scanning methods was unable to distinguish the effects of CMP time exposure on the crystal surface. Alternatively, the analysis of surface-related diffraction features recorded from on- and off-axis high-resolution reciprocal space maps (RSMs) allowed the classification of remnant damage in CMP-treated substrates as a function of CMP exposure time. By comparing the crystal truncation rod intensity and the pole diffuse scatter magnitude, differences at the near-surface regions of CMP-processed wafers were qualitatively and quantitatively measured. For AlN, the mapping of the (101¯3) reflection, observable under grazing incidence conditions, was introduced as an effective HRXRD method to analyze the crystal surface of AlN substrates using a laboratory source.;HRXRD methods were employed on high-quality non-polar homoepitaxial AlN films grown on m-plane AlN single crystals by metalorganic chemical vapor deposition. The films were deposited under identical growth conditions, within a temperature range between 1150&;The strain state and composition of AlxGa1-xN alloy epitaxial films deposited on (0001) AlN single crystals by MOCVD was studied using several HRXRD methods, including relative lattice parameter measurements (zone-axis techniques) and RSMs. Within the investigated compositional range, all alloy films were revealed to be pseudomorphic to the AlN substrate. However, crystallographic tilting was observed for several cases, which led to large errors in extracted biaxial stress relaxation values. To eliminate measurement error and further explore film tilting as a potential in-plane stress relaxation mechanism, alloy films were grown on 0.2&
机译:随着III族氮化物继续发展为同质外延生长方案,非常规计量学的发展对III族氮化物单晶和同质外延薄膜的正确研究变得至关重要。为了这个目的,本论文的工作集中在开发合适的高分辨率X射线衍射(HRXRD)方法上,这些方法因其灵敏性,准确性和无损性质而令人着迷。探索并开发了HRXRD技术,用于鉴定加工的III型氮化物单晶中的抛光引起的损伤,在AlN单晶上生长的非极性AlN同质外延膜的结构分析以及评估沉积的AlxGa1-xN外延层的合金膜特性在AlN衬底上进行AlN和GaN衬底的不同程度的机械抛光和化学机械抛光(CMP)。使用X射线摇摆曲线(XRC)峰展宽和扩散散射强度可以很容易地量化由侵蚀性抛光产生的总损伤。但是,一旦将晶片暴露于CMP处理后,发现使用线扫描方法无法区分CMP时间暴露在晶体表面上的影响。或者,通过对轴上和轴外的高分辨率互易空间图(RSM)记录的表面相关衍射特征的分析,可以将CMP处理的基材中的残余损伤分类为CMP暴露时间的函数。通过比较晶体截断棒强度和极扩散散射量,定性和定量地测量了CMP处理的晶片的近表面区域处的差异。对于AlN,引入了在掠入射条件下可观察到的(101′3)反射的映射,作为一种有效的HRXRD方法,使用实验室光源来分析AlN衬底的晶体表面。通过有机金属化学气相沉积在m平面AlN单晶上生长的极性同质外延AlN膜。在相同的生长条件下,在1150-1的温度范围内沉积膜;使用几种HRXRD方法,包括相对晶格参数测量,研究了通过MOCVD沉积在(0001)AlN单晶上的AlxGa1-xN合金外延膜的应变状态和组成。 (区域轴技术)和RSM。在所研究的组成范围内,所有合金膜均显示为对AlN衬底为假晶。然而,在几种情况下观察到晶体学倾斜,这导致提取的双轴应力松弛值的大误差。为了消除测量误差并进一步探讨膜倾斜是潜在的面内应力松弛机制的原因,在0.2和

著录项

  • 作者

    Bobea, Milena Rebeca.;

  • 作者单位

    North Carolina State University.;

  • 授予单位 North Carolina State University.;
  • 学科 Materials science.
  • 学位 Ph.D.
  • 年度 2015
  • 页码 247 p.
  • 总页数 247
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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