Surface treatment device, especially for lapping/polishing semiconductors, uses tool having carrier /support plate with work-plate fixed on carrier/support plate

摘要

A surface-treatment device comprises a treatment tool with a carrier/support plate (3) having a work-plate (5) arranged torsionally rigidly on the carrier/support plate, and formed by adjacent ring-elements (5a-c) and/or segments (5d) for holding a given work-piece. At least one ring-element and /or at least one segment is formed by a first part (5a'-5d') and second part (5a''-5d''), these parts being elastically joined. The second part (5a''-5d'') can be actuated by an actuator (13) to avoid mechanical influence of ring-elements (5a-c).