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Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board

机译:用于冷却电气部件和模块或系统(特别是载板或印刷电路板)的热交换器集成在电气印刷电路板中

摘要

The heat exchanger (1) is integrated in an electrical printed circuit board, and is conducted in a laminar manner. A surface is utilized as a thermal contact surface, which is connected with a heating source (6) that has to be cooled. A base body is provided with channels for guiding a cooling medium (11).
机译:热交换器(1)被集成在电气印刷电路板上,并且以层状方式被引导。利用表面作为热接触表面,该表面与必须被冷却的加热源(6)连接。基体设有用于引导冷却介质(11)的通道。

著录项

  • 公开/公告号DE102008050065A1

    专利类型

  • 公开/公告日2010-04-08

    原文格式PDF

  • 申请/专利权人 DZIADEK REINER;

    申请/专利号DE20081050065

  • 发明设计人 DZIADEK REINER;

    申请日2008-10-01

  • 分类号H01L23/42;H01L23/473;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 18:28:41

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