Process for producing silicon single crystal and heavily doped n-type semiconductor substrate

摘要

After adding phosphorus (P) and germanium (Ge) into a silicon melt or adding phosphorus into a silicon/germanium melt, a silicon monocrystal is grown from the silicon melt by a Czochralski method, where a phosphorus concentration [P]L (atoms/cm3) in the silicon melt, a Ge concentration in the silicon monocrystal, an average temperature gradient Gave (K/mm) and a pull speed V (mm/min) are controlled to satisfy a formula (1) as follows, the phosphorus concentration [P] (atoms/cm3) in the silicon monocrystal is 4.84×1019 atoms/cm3 or more and 8.49×1019 atoms/cm3 or less, and the phosphorus concentration [P] (atoms/cm3) and the Ge concentration [Ge] (atoms/cm3) in the silicon monocrystal satisfy a relationship according to a formula (2) as follows while growing the silicon monocrystal. [P]L+(0.3151×[Ge]+3.806×1019)/1.50.5×(Gave/V+43)×1019(1) [Ge]-6.95×[P]+5.90×1020(2).