Sensor device has housing, sensor chip and evaluation chip, where housing has inner chamber, in which sensor chip and evaluation chip are arranged, and sensor chip is arranged on bottom area of housing

摘要

The sensor device has a housing (110), a sensor chip (170,171) and an evaluation chip (180). The housing has an inner chamber, in which the sensor chip and the evaluation chip are arranged. The sensor chip is arranged on the bottom area (111) of the housing, and the evaluation chip is arranged on the sensor chip by adhesive layers (120). An independent claim is also included for a method for manufacturing a sensor device.