Method for manufacturing semiconductor device, involves providing chips mounted on carriers, and providing film on chip and carrier

摘要

The method involves providing (S1) chips mounted on carriers, and providing (S2) film on the chip and the carrier. The method involves directing (S3) laser beam on the film over the chip and the carrier. The film has a substance having a metal, which is metallic iron or nickel. An independent claim is also included for a method for producing a substrate with circuit connections, involves providing substrates having a layer of epoxy resin or polyethylene terephthalate or polyimide.