Method for manufacturing surface-mountable sensor chip e.g. differential pressure sensor chip, involves mounting sensor chip on film, by providing gel into recess of chip, where recess corresponds to aperture in film

摘要

The method involves providing a film (7) with an aperture (8) formed by stamping machine. A sensor chip (1) comprising a recess (3), is mounted on the film by providing gel into the recess which corresponds to the aperture. The sensor is comprised with a portion of wafer (5). An independent claim is included for sensor chip arrangement.