Method for manufacturing e.g. anisotropic magneto resistive effect sensor, involves assembling and contacting sensor chip on contacting surface of signal processing after signal processing chip is mounted on carrier frame

摘要

The method involves placing a spacer between a signal processing chip in form of an application-specific integrated circuit (6), and a carrier frame i.e. lead frame (4), before adhering the processing chip on the frame. The processing chip is assembled and contacted with an active contacting surface on the frame by adhering or soldering process. An anisotropic magneto resistive effect (AMR) sensor chip (8) is assembled and contacted on another active contacting surface of the processing chip after the processing chip is mounted on the frame. The active contacting surfaces are formed as connection points (10, 12). An independent claim is also included for an electronic component.