INFLOW BEHAVIOR OBSERVATION METHOD OF LIQUID SEALING RESIN COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of observing the behavior of an inflow of a liquid sealing resin composition into a semiconductor device assembled by a COF method or SOF method.;SOLUTION: The semiconductor device of the COF (chip on film) method or SOF (system on film) method includes two or more connection parts of a circuit on a heat-resistant film substrate 3, and a semiconductor element 1 mounted on the circuit or other electronic component, and is assembled by flowing and curing the liquid sealing resin composition 5 to the connection parts. The method of observing the behavior of the inflow of the liquid sealing resin composition into the connection parts is characterized in that a transparent heater 4 is arranged on a lower part of the heat-resistant film substrate of the semiconductor device, the connection parts is observed through a lower part of the semiconductor device from a lower part of the transparent heater, and at the same time the liquid sealing resin composition is supplied to the connection parts.;COPYRIGHT: (C)2012,JPO&INPIT