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METHOD FOR MOLDING WAFER LEVEL LENS ARRAY, MOLD, WAFER LEVEL LENS ARRAY, LENS MODULE, AND IMAGING UNIT
METHOD FOR MOLDING WAFER LEVEL LENS ARRAY, MOLD, WAFER LEVEL LENS ARRAY, LENS MODULE, AND IMAGING UNIT
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机译:晶片级透镜阵列,模具,晶片级透镜阵列,透镜模块和成像单元的模制方法
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摘要
PROBLEM TO BE SOLVED: To provide a molding method and a mold, which can suppress the positional dispersion of the lens part of a wafer level lens array to be produced.;SOLUTION: The molding method for molding the wafer level lens array having a substrate part and a plurality of lens parts arranged in the substrate part includes a process in which a liquid resin which is the material of the wafer level lens array is supplied to the region of a mold surface demarcated with a bank part formed by surrounding the entire periphery of the mold surface along the peripheral part of one of a pair mold members by using a pair of the mold members each having the mold surface including a lens transfer part in the shape of the inverted lens part, and by discharging the resin in an amount exceeding a necessary amount for molding the wafer level lens array from the region demarcated with the bank part, the resin in an amount necessary for molding the wafer level lens array in the region is measured, a process in which the resin held in the region is held by a pair of the mold members, and the resin is deformed into the shape of the mold surface, and a process for curing the resin held by a pair of the mold members.;COPYRIGHT: (C)2011,JPO&INPIT
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