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HIGHLY THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION FOR BLOW MOLDING

机译:吹模用高导热导热热塑性树脂组合物

摘要

PROBLEM TO BE SOLVED: To provide a resin material for blow molding which is excellent in thermal conductivity and whose molding upon blow molding exhibits good appearance without defects of appearance, such as filler floating.;SOLUTION: This highly thermally conductive thermoplastic resin composition for blow molding contains at least a highly thermally conductive thermoplastic resin of specific structure that comprises a repeating unit which is a unit comprising mainly a mesogen group and a spacer and that has thermal conductivity of 0.45 W/(m×K) as the simple resin.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种用于吹塑的树脂材料,该材料具有优异的导热性,并且其在吹塑时的模塑表现出良好的外观而没有外观缺陷,例如填料浮起。;解决方案:这种用于吹塑的高导热性热塑性树脂组合物模制品至少包含特定结构的高导热热塑性树脂,该树脂包括重复单元,该重复单元是主要包含液晶元基团和间隔基的单元,并且作为简单树脂具有0.45W /(m×K)的导热率。版权所有:(C)2011,日本特许厅和INPIT

著录项

  • 公开/公告号JP2011052204A

    专利类型

  • 公开/公告日2011-03-17

    原文格式PDF

  • 申请/专利权人 KANEKA CORP;

    申请/专利号JP20100096048

  • 发明设计人 YOSHIHARA HIDESUKE;MATSUMOTO KAZUAKI;

    申请日2010-04-19

  • 分类号C08G63/193;C08L67/02;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:21

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