首页> 外国专利> Highly thermally conductive thermoplastic resin composition, and a method of producing highly thermally conductive thermoplastic resin

Highly thermally conductive thermoplastic resin composition, and a method of producing highly thermally conductive thermoplastic resin

机译:高导热热塑性树脂组合物,以及生产高导热热塑性树脂的方法

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition excellent in thermal conductivity, maintaining such high thermal conductivity without blending a large amount of a high thermal conductive inorganic compound, and capable of being injection molded even when a general purpose mold for injection molding is used.SOLUTION: A thermoplastic resin composition mainly includes a thermoplastic resin of which a main chain has a repeating unit structure represented by general formula (1), where Aris a trivalent aromatic residue obtained by removing three carboxyl groups from an aromatic tricarboxylic acid, Sp is a bivalent straight substituent which may have a branch having 2 to 20 carbon atoms in the main chain, Aris a substituent selected from the group consisting of an aromatic group, a condensed aromatic group, a heterocyclic group, an alicyclic group and a cycloaliphatic and heterocyclic group, and an inorganic filler.
机译:解决的问题:提供一种热塑性优异的热塑性树脂组合物,在不掺入大量高导热性无机化合物的情况下保持如此高的导热率,并且即使在用于注射成型的通用模具中也能够进行注射成型。 SOLUTION:热塑性树脂组合物主要包括一种热塑性树脂,其主链具有通式(1)表示的重复单元结构,其中Aris是通过从芳香族三羧酸Sp中除去三个羧基而获得的三价芳香族残基是在主链上可以具有2至20个碳原子的支链的二价直链取代基,Aris是选自芳族基团,稠合芳族基团,杂环基团,脂环族基团和脂环族基团的取代基,并且杂环基和无机填料。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号