首页> 外国专利> CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, HIGHLY THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HIGHLY THERMALLY CONDUCTIVE MULTILAYER SUBSTRATE

CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, HIGHLY THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HIGHLY THERMALLY CONDUCTIVE MULTILAYER SUBSTRATE

机译:固化性树脂组合物,制备相同的方法,高导热性树脂组合物和高导热性多层基质

摘要

A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1):(In the formula (1),R1 represents a C4-20 hydrocarbyl group;R2 represents a C1-20 saturated hydrocarbylene group;R3 represents a C2-3 saturated hydrocarbylene group;R4 represents a C1-8 hydrocarbylene group;k represents an integer of 0 to 20;1 represents an integer of 0 to 20;m represents an integer of 0 to 20; andn represents an integer of 1 or 2, whereinwhere a plurality of Ri (i is 1 to 4) exist, the plurality of Ri may be the same as or different from each other;k -COR2O- groups, 1 -R3O- groups, and m -COR4COO- groups may be in any order; andwhere n is 2, two R1O(COR2O)k(R3O)l(COR4COO)m groups may be the same as or different from each other.)
机译:一种可固化树脂组合物,包括氮化铝颗粒,环氧树脂,固化剂和下式(1)表示的酸性磷酸酯:(在公式(1)中,R 1表示碳数4〜20的烃基。R 2表示碳数1〜20的饱和亚烃基。R3表示碳数2〜3的饱和亚烃基。R4表示碳数1〜8的亚烃基。k表示0至20的整数;1表示0至20的整数;m表示0〜20的整数。和n表示1或2的整数,其中在存在多个Ri(i为1至4)的情况下,多个Ri可以彼此相同或不同。k -COR2O-基团,1-R3O-基团和m -COR4COO-基团可以任意顺序;和(n为2时,两个R1O(COR2O)k(R3O)1(COR4COO)m基团可以相同或不同。)

著录项

  • 公开/公告号EP2832792A1

    专利类型

  • 公开/公告日2015-02-04

    原文格式PDF

  • 申请/专利权人 TOKUYAMA CORPORATION;

    申请/专利号EP20130767287

  • 发明设计人 OHNO HIDEKI;

    申请日2013-03-28

  • 分类号C08L63/00;C08K3/28;C08K5/52;H01L23/12;H01L23/36;

  • 国家 EP

  • 入库时间 2022-08-21 15:03:51

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