首页> 外国专利> ELECTRICALLY INSULATING AND HIGHLY THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION AND HIGHLY THERMALLY CONDUCTIVE MOLDED ARTICLE

ELECTRICALLY INSULATING AND HIGHLY THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION AND HIGHLY THERMALLY CONDUCTIVE MOLDED ARTICLE

机译:电绝缘且高导热性的热塑性树脂组合物和高导热性的模制件

摘要

PPROBLEM TO BE SOLVED: To provide an inorganic material-containing thermoplastic resin composition having electrically insulating properties and excellent thermal conductivity. PSOLUTION: The thermoplastic resin composition having reduced thermal resistance at the interface of a highly thermally conductive inorganic compound and having high thermal conductivity while maintaining electric insulation properties at least contains a thermoplastic resin, the highly thermally conductive inorganic compound having ≥1.5 W/m K thermal conductivity as a simple substance and ≥0.1 Ωcm volume specific resistance, an electrically insulating low-melting point inorganic material having ≤350°C softening point. The molded article is molded out of the resin composition. A low-melting point glass having a specific composition is preferable as the electrically insulating low-melting point inorganic material having ≤350°C softening point. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:

要解决的问题:提供一种具有电绝缘性和优异的导热性的含无机材料的热塑性树脂组合物。

解决方案:在高导热性无机化合物的界面处具有降低的耐热性并且在保持电绝缘性的同时具有高导热性的热塑性树脂组合物至少包含热塑性树脂,该高导热性无机化合物具有≥ 1.5 W / m K为单质热导率,体积比电阻为0.1Ωcm以上,一种电绝缘的低熔点无机材料,其软化点为350℃。模制品由树脂组合物模制而成。具有特定组成的低熔点玻璃优选作为软化点为350℃以下的电绝缘性低熔点无机材料。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2008169265A

    专利类型

  • 公开/公告日2008-07-24

    原文格式PDF

  • 申请/专利权人 KANEKA CORP;

    申请/专利号JP20070002112

  • 发明设计人 KAKEHASHI YASUSHI;MATSUMOTO KAZUAKI;

    申请日2007-01-10

  • 分类号C08L101/00;C08K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:24:16

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