REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, DICING TAPE INTEGRATED REAR-SURFACE FILM FOR FLIP-CHIP SEMICONDUCTOR, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND FLIP-CHIP SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a rear-surface film for a flip-chip semiconductor that can suppress or prevent the warp of a semiconductor element which is mounted onto an adherend by flip chip connection.;SOLUTION: A rear-surface film for a flip-chip semiconductor to be provided for a rear surface of a semiconductor element which is mounted on an adherend by flip chip comprises a thermally curable resin and thermal cure promoting catalyst, in which the proportion of the thermal cure promoting catalyst to the total amount of the thermally curable resin is 1.5 wt.% or more and 20 wt.% or less.;COPYRIGHT: (C)2012,JPO&INPIT