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METHOD OF MANUFACTURING CUBIC SILICON CARBIDE SINGLE-CRYSTAL THIN FILM, AND SEMICONDUCTOR DEVICE

机译:制造立方碳化硅单晶薄膜的方法及半导体器件

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a cubic silicon carbide single-crystal thin film for obtaining a low-cost cubic silicon carbide (3C-SiC) single-crystal thin film, and to provide a semiconductor device.;SOLUTION: The method of manufacturing a cubic silicon carbide single-crystal thin film includes: a first process for forming a sacrifice layer 102 on the surface of a substrate 101; a second process for forming a cubic crystal system semiconductor layer 103 of which at least a surface layer is in a cubic crystal system structure on the surface of the sacrifice layer; a third process for forming a cubic silicon carbide single-crystal layer 104 on the surface of the cubic crystal system semiconductor layer; and a fourth process for separating a laminate of the cubic crystal system semiconductor layer and the cubic silicon carbide single-crystal layer by removing the sacrifice layer by etching.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种制造立方碳化硅单晶薄膜的方法,以获得低成本的立方碳化硅(3C-SiC)单晶薄膜,并提供一种半导体器件。制造立方晶碳化硅单晶薄膜的方法包括:在衬底101的表面上形成牺牲层102的第一工艺;第二工序,在牺牲层的表面上形成至少表面层为立方晶系结构的立方晶系半导体层103。第三工序,用于在立方晶系半导体层的表面上形成立方碳化硅单晶层104。通过蚀刻去除牺牲层而分离立方晶系半导体层和立方碳化硅单晶层的层叠体的第四工艺。版权所有:(C)2011,日本特许厅

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