首页> 外国专利> COOLANT FOR CUTTING CRYSTAL SILICON AND METHOD FOR CUTTING CRYSTAL SILICON BY USING THE SAME

COOLANT FOR CUTTING CRYSTAL SILICON AND METHOD FOR CUTTING CRYSTAL SILICON BY USING THE SAME

机译:用于切割晶体硅的冷却剂和使用该硅酸盐切割硅的方法

摘要

PROBLEM TO BE SOLVED: To provide a coolant for cutting crystal silicon which has high cooling effect and can prevent the production of silica sol even when using a wire saw with a wire, on which diamond is stuck, in the case of cutting the crystal silicon.;SOLUTION: The coolant for cutting the crystal silicon is obtained by using water as a principal component, and adding a water-soluble oxidizing agent such as hydrogen peroxide thereto. It is preferable that a rust-preventive such as benzotriazol, tolyl triazol, 2-mercapto benzothiazol, 3(2-(benzothiazolyl)thio) propionic acid or polycarboxylic acid is blended, and it is more preferable that an amino compound is added.;COPYRIGHT: (C)2011,JPO&INPIT
机译:要解决的问题:提供一种用于切割晶体硅的冷却剂,该冷却剂具有很高的冷却效果,即使在使用带有金刚石的线锯的情况下也能防止硅溶胶的产生,在切割晶体硅的情况下解决方案:用于切割晶体硅的冷却剂是通过以水为主要成分,并向其中添加水溶性氧化剂(例如过氧化氢)获得的。优选混合苯并三唑,甲苯基三唑,2-巯基苯并噻唑,3(2-(苯并噻唑基)硫代)丙酸或多元羧酸等防锈剂,更优选添加氨基化合物。版权所有:(C)2011,日本特许厅和INPIT

著录项

  • 公开/公告号JP2011102362A

    专利类型

  • 公开/公告日2011-05-26

    原文格式PDF

  • 申请/专利权人 OKAHARA HARUO;

    申请/专利号JP20090257977

  • 发明设计人 OKAHARA HARUO;

    申请日2009-11-11

  • 分类号C10M173/02;H01L21/304;B28D5/04;C10M125/20;C10M125/10;C10M125/22;C10M125/26;C10M125/16;C10M125/18;C10M133/38;C10M135/36;C10M129/34;C10M129/42;C10M133/04;C10N30/00;C10N40/22;C10N40/32;

  • 国家 JP

  • 入库时间 2022-08-21 18:23:40

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