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Effects of cutting angles on deformation of single crystal silicon in plunge cutting along〈100〉direction

机译:切削角度对沿<100>方向切入的单晶硅变形的影响

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Understanding the formation of cleavage fracture is meaningful for cutting silicon in ductile mode. In this study, the (0 0 1) single crystal silicon was cut along < 1 0 0 > direction with plunging angles of 0.07 degrees, 0.12 degrees and 0.17 degrees. Three regions with characteristics of ductile removal, cleavage and random fractures were observed on the cutting grooves. Increase in the plunging angles not only contributes to the large critical depth of cut, but also reduces the cleavage length due to the enhancement of hydrostatic pressures. Besides, the {1 1 1} plane is the potential plane for the initiation and propagation of cleavage fractures during plunge cutting the silicon along < 1 0 0 > direction. (C) 2019 Elsevier B.V. All rights reserved.
机译:理解断裂断裂的形成对于以延性模式切割硅是有意义的。在本研究中,沿着<1 0 0>方向切割了(0 0 1)单晶硅,其俯角为0.07度,0.12度和0.17度。在切槽上观察到三个具有韧性去除,劈裂和随机断裂特征的区域。切入角的增加不仅有助于增大切削的临界深度,而且由于增加了静水压力而减小了劈裂长度。此外,{1 1 1}平面是在沿<1 0 0>方向切入硅时切入断裂的引发和传播的潜在平面。 (C)2019 Elsevier B.V.保留所有权利。

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