METHOD OF CUTTING WORK-PIECE, METHOD OF CUTTING SILICON SINGLE CRYSTAL, AND METHOD OF MANUFACTURING SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method of cutting a work-piece capable of achieving long life of a blade.;SOLUTION: A method of cutting silicon single crystal S cuts silicon single crystal while supplying RO water having water temperature of 21°C or more and 40°C or less which is impurities removed water by a reverse osmosis membrane (an ultrafine particle filter of 0.0001 μm) onto a blade 4 of a band saw.;SELECTED DRAWING: Figure 6;COPYRIGHT: (C)2018,JPO&INPIT