METHOD OF TEMPORAL PRESSURE BONDING OF ANISOTROPIC CONDUCTIVE ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a method of temporal pressure bonding of an anisotropic conductive adhesive film to a circuit member, which method suppresses foaming.SOLUTION: In the method of temporal pressure bonding of an anisotropic conductive adhesive film, an anisotropic conductive adhesive film 1 is temporally pressure bonded to a circuit member 2 while being applied with ultrasonic waves or microwaves.