首页> 外国专利> EXPOSURE PROCESSING METHOD, EXPOSURE DEVICE USING THE SAME, EXPOSURE PROCESSING SYSTEM, METHOD FOR MANUFACTURING DEVICE, INFORMATION PROCESSOR AND EXPOSURE PROCESSING PROGRAM

EXPOSURE PROCESSING METHOD, EXPOSURE DEVICE USING THE SAME, EXPOSURE PROCESSING SYSTEM, METHOD FOR MANUFACTURING DEVICE, INFORMATION PROCESSOR AND EXPOSURE PROCESSING PROGRAM

机译:曝光处理方法,使用该曝光处理设备的曝光设备,曝光处理系统,制造设备的方法,信息处理器和曝光处理程序

摘要

PROBLEM TO BE SOLVED: To calculate the synchronising accuracy of a shot region on a substrate in both scan directions without interrupting a scanning/exposing processing.;SOLUTION: An exposure processing method in which a plurality of regions configuring an array defined on a substrate is exposed by synchronously moving a reticle stage holding an original plate and a wafer stage holding a substrate in a predetermined scanning direction, includes an extracting step S1 for extracting device information to be obtained through an exposure processing in a plurality of regions; and a calculating step S4, S5 for calculating interpolating value for interpolating device information in a region synchronously moved in a second scanning direction based on device information in a region synchronously moved in a first scanning direction.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:在不中断扫描/曝光处理的情况下,在两个扫描方向上计算基板上的曝光区域的同步精度。解决方案:一种曝光处理方法,其中多个区域构成基板上定义的阵列。通过在预定的扫描方向上同步移动保持原版的掩模版台和保持基板的晶片台进行曝光,包括提取步骤S1,该提取步骤S1在多个区域中提取将通过曝光处理获得的器件信息。计算步骤S4,S5,用于基于在第一扫描方向上同步移动的区域中的设备信息来计算插值,该插值用于在第二扫描方向上同步移动的区域中插入设备信息。COPYRIGHT:(C)2011,JPO&INPIT

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