The etched circuit baseplate of rigidity the etched circuit baseplate of method and the rigidity which the contact partner and it makes contact make connect and the device which consists of the contact partner

摘要

With this invention, as for particular method it possesses the step below electric connection the etched circuit baseplate of rigidity in regard to the method (1) and the contact partner of the metal make (2) of forming between: At least copper layer (3) and one prepreg layer (5) it includes at least, in order the etched circuit baseplate of rigidity the step which (1) is offered and the contact partner of the, aforementioned metal make (2), the aforementioned etched circuit baseplate (1) copper layer (3) the contact pad above (7) with this to touch, removing the aforementioned prepreg layer (5) the contact partner of aforementioned metal make (2) and the aforementioned etched circuit baseplate (1) the step which is made to approach and the, aforementioned contact pad (7) at least in one part territory, the aforementioned etched circuit baseplate (1) the step which forms the notch inside and the, laserLight (9) we have possessed with the step which is irradiated, welded connection the aforementioned contact partner (2) and the aforementioned contact pad (7) with is formed between here. This invention furthermore, the etched circuit baseplate of rigidity the contact partner (1) and the metal make (2) regards the module which includes the device, and this kind of device which consist of electric joints.