Making the ethylene characteristic unsaturated monomer component polymerize which contains ethylene characteristic unsaturated monomer (i) it possesses the epoxy basis, the epoxy basic content polymer which can (a), and the epoxy basic content isoshianureto derivative (b) containing, the ultraviolet ray hardenable resin which is obtained saturation or the unsaturated polybasic acid anhydride (d) by reacting in the intermediate product which the ethylene characteristic unsaturated monomer which possesses the carboxyl group (c) with reacts the epoxy compound component which becomes, is obtained (A); The epoxy compound which possesses the epoxy basis 2 or more in the molecule (B); Photo polymerization initiator (C); Diluent the ultraviolet ray hardenable resin composition which (D) is included is offered. As for huotosorudarejisutoinku which includes this resin composition, being development possible with the dilute alkali aqueous solution, it is possible to form sorudarejisuto which is superior in solder heat resistance and resistance gold-plating characteristic on the baseplate.
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