Production apparatus used in the practice of the manufacturing method and manufacturing method of a semiconductor device

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of making the wafer holding interval of a holding means which holds a plurality of wafers in a warped state smaller than before for instance, and a manufacturing device used for executing the manufacturing method.;SOLUTION: In respective manufacturing processes such as an ion implantation process, a stage 31 is used with suction holes 32 communicated with a suction means on the entire surface area of the stage 31, provided with a first suction hole 32a positioned on one center line of the stage 31, and a second suction hole 32b positioned on the other part. The entire surface of the wafer 21 is sucked to the surface of the stage 31, each processing is executed to the wafer 21, and then suction is released in the order of the second suction hole 32b and the first suction hole 32a. Thus, the wafer 21 is warped in a fixed direction at all times and the wafer 21 is carried into the holding means while maintaining the state of being warped in the direction.;COPYRIGHT: (C)2007,JPO&INPIT