首页> 外国专利> MANUFACTURING METHOD OF ELECTRIC AND ELECTRONIC COMPONENT SEALED WITH POLYESTER RESIN OF POLYMERIZED CYCLIC POLYESTER OLIGOMER

MANUFACTURING METHOD OF ELECTRIC AND ELECTRONIC COMPONENT SEALED WITH POLYESTER RESIN OF POLYMERIZED CYCLIC POLYESTER OLIGOMER

机译:聚合的循环聚酯低聚物用聚酯树脂密封的电气电子部件的制造方法

摘要

PROBLEM TO BE SOLVED: To solve the following problems: an epoxy type thermosetting resin so far been used for sealing an electric-electronic component is accompanied with bad smell upon thermosetting, and sealing with conventional thermoplastic resin is accompanied with bad fluidizability and thus shapes to be sealed are limited.;SOLUTION: In a manufacturing method including the step of sealing an electric-electronic component with a resin, a cyclic polyester oligomer is introduced into a die under fusing the oligomer at its melting point or higher and an electric-electronic component is sealed with a polyester resin obtained by thermo-polymerizing reaction of the cyclic polyester oligomer in the sealing die.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:为了解决以下问题:迄今为止,用于密封电子部件的环氧树脂型热固性树脂在热固性时伴随着难闻的气味,并且与常规的热塑性树脂一起密封伴随着不良的流化性,因此成型为解决方案:在包括用树脂密封电子部件的步骤的制造方法中,将环状聚酯低聚物在低聚物的熔点或更高熔点下熔融并引入电子中,将环状聚酯低聚物引入模具中用密封模中环状聚酯低聚物的热聚合反应得到的聚酯树脂密封组件。; COPYRIGHT:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011000816A

    专利类型

  • 公开/公告日2011-01-06

    原文格式PDF

  • 申请/专利权人 TOYOBO CO LTD;

    申请/专利号JP20090146620

  • 发明设计人 NAGAHARA SHIGENORI;IDO YOSHINORI;

    申请日2009-06-19

  • 分类号B29C39/24;C08G63/183;C08G63/78;H01L21/56;B29C45/02;B29C45/00;B29C39/10;B29C45/14;H05K3/28;B29K33/04;

  • 国家 JP

  • 入库时间 2022-08-21 18:19:21

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