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Equipment for carrying out the method, and method and teaches the bonding position on the wire bonding machine, to inspect the wire loop
Equipment for carrying out the method, and method and teaches the bonding position on the wire bonding machine, to inspect the wire loop
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机译:用于执行该方法的设备和方法,并教导引线接合机上的接合位置,以检查引线环
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摘要
A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.
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