Bonding properties, straightness and bonding wire for gold alloy wire having excellent resin flowability

摘要

The present invention provides: a metal alloy wire for a bonding wire that has excellent bonding properties, linearity, and resin flow resistance properties. [Solution] The metal alloy for a bonding wire has a component composition in which Ca: 40-80 ppm and Eu:5-40 ppm are contained, Be: 1-10 ppm is contained as required, one or two kinds or more of Ba, Sr, Bi, Y, La, Ce, Pr, Nd, Sm, Tb, Ho, Er, Tm, Yb and Lu totaling 5-19 ppm are contained as required, and moreover Ag: 1-10 ppm is contained as required, and the rest is composed of Au and unavoidable impurities, wherein assuming that the 0.2% proof stress of the metal alloy wire for a bonding wire is &sgr;0.2, Young's modulus is E, and elongation is EL, then E ≥ 75GPa, (&sgr; 0.2/E) ≥ 2.2×10-3, and 3% EL ≤10%.