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LED package and LED package frame to adopt this
LED package and LED package frame to adopt this
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机译:LED封装和采用该封装的LED封装框架
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摘要
PROBLEM TO BE SOLVED: To provide an LED package frame, and an LED package that include the package frame.;SOLUTION: The LED package frame includes an LED chip a heat-conducting member made of a block of a material having superior thermal conductivity with one surface, adapted to install the LED chip and side portions each formed to have an inward recessed receiving section; leads each being received at one end in the receiving section in the heat-conducting member to have an electrical connection with the LED chip; and electrically insulating layers each provided tightly between the receiving section in the heat-conducting member and the lead so as to isolate one of the receiving section and the lead from the other. Incorporating the leads into the heat-conducting member in this way enables reduction of the volume, while sustaining both high thermal conductivity, with safety of an LED package frame and a high output LED package. In addition, securing the leads to the heat-conducting member without additional jigs enables mass production of LED package frames and high-output LED packages.;COPYRIGHT: (C)2006,JPO&NCIPI
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