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LED package and LED package frame to adopt this

机译:LED封装和采用该封装的LED封装框架

摘要

PROBLEM TO BE SOLVED: To provide an LED package frame, and an LED package that include the package frame.;SOLUTION: The LED package frame includes an LED chip a heat-conducting member made of a block of a material having superior thermal conductivity with one surface, adapted to install the LED chip and side portions each formed to have an inward recessed receiving section; leads each being received at one end in the receiving section in the heat-conducting member to have an electrical connection with the LED chip; and electrically insulating layers each provided tightly between the receiving section in the heat-conducting member and the lead so as to isolate one of the receiving section and the lead from the other. Incorporating the leads into the heat-conducting member in this way enables reduction of the volume, while sustaining both high thermal conductivity, with safety of an LED package frame and a high output LED package. In addition, securing the leads to the heat-conducting member without additional jigs enables mass production of LED package frames and high-output LED packages.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种LED封装框架以及包括该封装框架的LED封装。解决方案:该LED封装框架包括LED芯片,由一块导热性优异的材料制成的导热构件,其中一个表面,适于安装LED芯片和侧部,每个侧部形成为具有向内凹进的容纳部。导通到所述导热构件的所述容纳部的一端,并与所述LED芯片电连接。电绝缘层分别紧密地设置在导热构件中的容纳部和引线之间,以使容纳部和引线中的一个彼此隔离。以这种方式将引线结合到导热构件中使得能够减小体积,同时保持高导热率,同时具有LED封装框架和高输出LED封装的安全性。此外,无需额外的夹具即可将引线固定到导热部件,从而可以批量生产LED封装框架和高输出LED封装。版权所有:(C)2006,JPO&NCIPI

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