The present invention provides an approach for overcoming the problem of using a printed circuit board for mounting LEDs in a conventional LED lamp. Provided is a lead frame by a wire binding method including: a main body (10) mounted with a semiconductor chip; an input unit (20) extending from one side of the main body (10) and having one end with a wire hole (21) with a predetermined diameter for the passage of a wire; and an output unit (30) extending from the other side of the main body (10) and having one end with a wire hole (21) with a predetermined diameter for the passage of a wire. The invention further relates to an LED power lamp using same.
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