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ENHANCED ELECTROMIGRATION PERFORMANCE OF COPPER LINES IN METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES BY SURFACE ALLOYING
ENHANCED ELECTROMIGRATION PERFORMANCE OF COPPER LINES IN METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES BY SURFACE ALLOYING
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机译:表面合金在半导体器件金属化系统中铜线的增强电迁移性能
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摘要
In sophisticated semiconductor devices, the electromigration performance of copper metal lines at the top interface thereof may be enhanced by forming a copper alloy that is locally restricted to the interface. To this end, an appropriate alloy-forming species, such as aluminum, may be provided on the basis of a non-masked deposition process and may be subsequently removed by a non-masked etch process, wherein the characteristic of the resulting alloy may be adjusted during an intermediate heat treatment.
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