Semiconductor Package and Trace Substrate with Enhanced Routing Design Flexibility and Method of Manufacturing Thereof

摘要

A semiconductor package, a method for manufacturing the semiconductor package, a trace substrate and a method for manufacturing the trace substrate are provided. The semiconductor package includes a trace substrate, a chip and a plurality of wires. The trace substrate includes a plurality of trace, a plurality of conductive studs, a plurality of traces pads and a trace modling compound. The conductive studs are formed on the lower surfaces of the traces. The trace modling compound encapsulates the conductive studs and the trace, and exposes the lower surfaces of the conductive studs and the upper surfaces of the traces. The chip is disposed on the trace substrate, and the wires electrically connect the chip and the trace pads. The trace pads are not overlapping to the conductive studs.