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Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material
Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material
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机译:树脂基板材料,通过化学镀制造的电子零件基板材料以及电子零件基板材料的制造方法
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摘要
There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.
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