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Electrically Conductive Thermoplastic/Metal Hybrid Materials for Direct Manufacturing of Electronic Components

机译:用于直接制造电子元件的导电热塑性/金属杂化材料

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The work presents a novel polymer/metal hybrid material consisting of a thermoplastic polymer, copper fibers, and a low melting metal alloy, which is molten during processing. The material allows for electrical conductivities comparable to those of steel and still offers a good processability by injection molding. Still, the material's high metal content influences the filling and freezing behavior and therewith the part properties significantly. Injection molding trials were performed to characterize the filler distribution and the resulting electrical conductivity in dependence on the processing conditions and the matrix polymer choice. The metal alloy allows a homogeneous filler distribution within the part, which results in a high surface conductivity. Still, due to fiber-poor shear zones the electrical conductivity measured over the part thickness is decreased in comparison to the passage conductivity. A more homogeneous conductivity distribution can be achieved when the metal alloy has a higher melting point than the chosen polymer matrix. The high metal content and therewith the increased thermal conductivity of the material limits the realizable flow lengths. Here, adjustments to the mold temperature control allow a significant increase of the material processability and flowability for an optimized production of conducting Structures.
机译:该作品提出了一种新型的聚合物/金属杂化材料,该材料由热塑性聚合物,铜纤维和低熔点金属合金组成,它们在加工过程中会熔化。该材料的导电性可与钢媲美,并且仍可通过注塑成型提供良好的加工性能。仍然,材料的高金属含量会影响填充和冻结行为,从而影响零件的性能。根据加工条件和基体聚合物的选择,进行注塑试验以表征填料分布和所得的电导率。金属合金使零件内的填料分布均匀,从而提高了表面导电性。尽管如此,由于纤维剪切区较差,在零件厚度上测得的电导率与通过电导率相比仍降低了。当金属合金的熔点高于所选聚合物基体的熔点时,可以获得更均匀的电导率分布。高金属含量以及由此增加的材料导热性限制了可实现的流动长度。在此,对模具温度控制的调整可显着提高材料的可加工性和流动性,以优化生产导电结构。

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