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International Congress on Molded Interconnect Devices

召开年：2018
召开地：Wurzburg(DE)
出版时间：-

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1.Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies

机译：通过印刷技术生成用于高频应用的3D功能结构
- 作者：Markus Ankenbrand;Matthias Scheetz;Joerg Franke;Konstantin Lomakin;Mark Sippel;Gerald Gold;Klaus Helmreich
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Ink;
- Printing;
- Substrates;
- Conductivity;
- Microstrip;
- Radio frequency;
- Attenuation;
2.Integration of electronic components in the thermoplastic processing chain: possibilities through additive manufacturing using conductive materials

机译：将电子组件集成到热塑性塑料加工链中：使用导电材料进行增材制造的可能性
- 作者：Manuel V. C. Morais;Robin Reidel;Patrick Weiss;Sascha Baumann;Christof Hübner;Frank Henning
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Three-dimensional printing;
- Polymers;
- Chemical technology;
- Capacitive sensors;
- Nanocomposites;
- Carbon nanotubes;
- Tactile sensors;
3.Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes

机译：安装在印刷聚合物厚膜浆料上的SMT组件的长期性能
- 作者：Julian Schirmer;Kilian Eisen;Marcus Reichenberger;Jewgeni Roudenko;Simone Neermann;Jörg Franke
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Resistance;
- Conductive adhesives;
- Soldering;
- Printing;
- Force;
- Electrical resistance measurement;
4.Effect of talc on the metal adhesion of laser-structured polymer parts

机译：滑石粉对激光结构聚合物零件金属附着力的影响
- 作者：Andreas J. Fischer;Dietmar Drummer;Thomas Kuhn;Jorg Franke
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Adhesives;
- Polymers;
- Metallization;
- Surface emitting lasers;
- Scanning electron microscopy;
- Rough surfaces;
5.New standards for 3D-userinterfaces-manufactured by a Film Insert Molding process

机译：薄膜插入成型工艺制造的3D用户界面新标准
- 作者：Annette Wimmer;Herbert Reichel;Klaus Schmidt
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Conductors;
- Automotive engineering;
- Conductivity;
- Printing;
- Tools;
- Resistance;
- Electrodes;
6.Low-Temperature Sintering of Nanometal Inks on Polymer Substrates

机译：聚合物基底上纳米金属油墨的低温烧结
- 作者：Jürgen Keck;Birger Freisinger;Daniel Juric;Kerstin Gläser;Martin Völker;Wolfgang Eberhardt;André Zimmermann
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Ink;
- Silver;
- Printing;
- Gold;
- Curing;
- Nanoparticles;
7.Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates

机译：对流烧结参数对柔性基底上喷墨印刷银纳米粒子油墨电导率和附着力的影响
- 作者：Jewgeni Roudenko;Julian Schirmer;Marcus Reichenberger;Simone Neermann;Jorg Franke
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Ink;
- Adhesives;
- Temperature measurement;
- Substrates;
- Resistance;
- Silver;
- Periodic structures;
8.Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID

机译：模制互连设备MID上阵列对LED热管理影响的实验和计算研究
- 作者：Mahdi Soltani;Yunsi Liu;André Zimmermann;Romit Kulkarni;Maximilian Barth;Tobias Groezinger
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Thermal conductivity;
- Substrates;
- Light emitting diodes;
- Heating systems;
- Temperature measurement;
- Conductivity;
- Thermal management;
9.Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing

机译：注塑参数对高达3 GHz的高频介电常数对MID热塑性塑料和环境测试过程中介电常数可靠性的影响的研究
- 作者：Marius Wolf;Florian Janek;Thomas Meißner;Benedikt Wigger;Maximilian Barth;Thomas Günter;Wolfgang Eberhardt;André Zimmermann;Volker Geneiß;Tobias Lüke;Christian Hedayat;Thomas Otto
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Permittivity;
- Resonant frequency;
- Substrates;
- Injection molding;
- Permittivity measurement;
- Performance evaluation;
10.Laser Assisted Selective Metallization of Polymers

机译：激光辅助聚合物的选择性金属化
- 作者：Karolis Ratautas;Aldona Jagminienė;Ina Stankevičienė;Eugenijus Norkus;Gediminas Račiukaitis
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Surface treatment;
- Surface resistance;
- Rough surfaces;
- Surface roughness;
- Surface morphology;
- Surface emitting lasers;
- Plastics;
11.Functionalization of additive manufactures components with laser direct structurable lacquer

机译：增材制造部件的功能化，采用激光可直接结构化的漆
- 作者：Thomas Mager;Christoph Jürgenhake;Roman Dumitrescu
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Surface treatment;
- Lacquers;
- Prototypes;
- Rough surfaces;
- Surface roughness;
- Additives;
12.The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer

机译：3D-MID技术在全向感应无线功率传输中的潜力
- 作者：Kamotesov Sergkei;Philippe Lombard;Vincent Semet;Bruno Allard;Maël Moguedet;Michel Cabrera
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Receivers;
- Inductors;
- Coils;
- Three-dimensional displays;
- Q-factor;
- RLC circuits;
- Copper;
13.Long Term Reliability of Mechatronic Devices Generated by Fused Layer Modeling and Laser Assisted Sintering of Printed Structures

机译：融合层建模和印刷结构的激光辅助烧结产生的机电设备的长期可靠性
- 作者：Bernd Niese;Bastian Geißler;Thomas Frick;Stephan Roth;Michael Schmidt
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Laser sintering;
- Conductivity;
- Radiation effects;
- Silver;
- Conductors;
- Periodic structures;
- Heating systems;
14.Electrical and Mechanical Qualification of Selectively Dispensed Active Brazes

机译：选择性分配的活性铜的电气和机械鉴定
- 作者：Thomas Stoll;Joerg Franke
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Brazing;
- Qualifications;
- Ceramics;
- Substrates;
- Firing;
- Titanium;
- Electrical resistance measurement;
15.Limits of ceramics in the 3D-MID with additively produced aluminum substrate

机译：3D-MID中使用增材制造的铝基板时陶瓷的限制
- 作者：Elisa Götze;Kevin Postler;Stefan Buschulte;Frederik Zanger;Volker Schulze
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Cleaning;
- Ceramics;
- Slurries;
- Three-dimensional printing;
- Substrates;
16.Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices

机译：激光诱导3D陶瓷互连器件的选择性金属化
- 作者：Eugen Ermantraut;André Zimmermann;Hagen Müller;Marius Wolf;Wolfgang Eberhardt;Philipp Ninz;Frank Kern;Rainer Gadow
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Ceramics;
- Substrates;
- Pulsed laser deposition;
- Three-dimensional displays;
- Solid lasers;
- Copper;
17.Influences of Manufacturing Sequences for the Application of Printed Electronics on Aircraft Interior Components

机译：制造顺序对印刷电子在飞机内部组件上的应用的影响
- 作者：Nils Ischdonat;Christian Dreyer;Daniel Gräf;Jörg Franke;Johannes Hörber;Martin Hedges
- 会议名称：《》 | 2018年
- Printed circuits;
- Printing;
- Ink;
- Conductivity;
- Substrates;
- Manufacturing;
- Curing;
18.Optimized Thermoforming Process for Conformable Electronics

机译：整合电子的优化热成型工艺
- 作者：Christine Kallmayer;Florian Schaller;Thomas Löher;Julian Haberland;Fabian Kayatz;André Schult
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Printed circuits;
- Thermoforming;
- Fabrication;
- Substrates;
- Integrated circuit interconnections;
- Strain;
- Three-dimensional displays;
19.Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures

机译：推动3D-MID的边界：脉冲宽度调制光技术，用于增强表面特性并在FFF打印结构上启用印刷电子
- 作者：Daniel Gräf;Simone Neermann;Lisa Stuber;Matthias Scheetz;JÖrg Franke
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Surface treatment;
- Rough surfaces;
- Surface roughness;
- Printing;
- Field-flow fractionation;
- Ink;
- Silver;
20.Applications of Three Dimensional Laser Induced Metallization Technology with Polymer Coating

机译：聚合物涂层三维激光诱导金属化技术的应用
- 作者：Chieh Yang;Min-Chieh Chou;Tune-Hune Kao;Meng-Chi Huang
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Mobile antennas;
- Polymer films;
- Substrates;
- Lasers;
- Three-dimensional displays;
- Humanoid robots;
21.Development of LS-LDS combined process and material enabling simultaneous activation during additive manufacturing process

机译：LS-LDS结合工艺和材料的开发，可在增材制造过程中同时激活
- 作者：Toshiki NIINO;Tetsuya WATANABE;Miki Mori
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Laser sintering;
- Powders;
- Fiber lasers;
- Plastics;
- Plating;
- Carbon;
- Laser beams;
22.Cu Paste for Molded Interconnect Devices

机译：模制互连设备的铜浆
- 作者：Yoshinori Ejiri;Shinichirou Sukata;Masaya Toba;Kosuke Urashima;Motoki Yonekura;Takaaki Noudou;Yoshiaki Kurihara;Hiroshi Masuda
- 会议名称：《International Congress on Molded Interconnect Devices》 | 2018年
- Wiring;
- Substrates;
- Printing;
- Epoxy resins;
- Three-dimensional displays;
- Two dimensional displays;
- Aerosols;