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Process using oxide supporter for manufacturing a capacitor lower electrode of a micro stacked DRAM

机译:使用氧化物支撑物制造微堆叠DRAM的电容器下电极的方法

摘要

A process using oxide supporter for manufacturing a capacitor lower electrode of a micron stacked DRAM is disclosed. First, form a stacked structure. Second, form a photoresist layer on an upper oxide layer and then etch them. Third, deposit a polysilicon layer onto the upper oxide layer and the nitride layer. Fourth, deposit a nitrogen oxide layer on the polysilicon layer and the upper oxide layer. Sixth, partially etch the nitrogen oxide layer, the polysilicon layer and the upper oxide layer to form a plurality of vias. Seventh, oxidize the polysilicon layer to form a plurality of silicon dioxides surround the vias. Eighth, etch the nitride layer, the dielectric layer and the lower oxide layer beneath the vias. Ninth, form a metal plate and a capacitor lower electrode in each of the vias. Tenth, etch the nitrogen oxide layer, the polysilicon layer, the nitride layer and the dielectric layer.
机译:公开了一种使用氧化物支撑体来制造微米堆叠的DRAM的电容器下电极的方法。首先,形成堆叠结构。其次,在上部氧化物层上形成光致抗蚀剂层,然后对其进行蚀刻。第三,在上部氧化物层和氮化物层上沉积多晶硅层。第四,在多晶硅层和上部氧化物层上沉积氮氧化物层。第六,部分蚀刻氮氧化物层,多晶硅层和上氧化物层以形成多个通孔。第七,氧化多晶硅层以形成围绕通孔的多个二氧化硅。第八,蚀刻通孔下方的氮化物层,介电层和下部氧化物层。第九,在每个通孔中形成金属板和电容器下电极。第十,蚀刻氮氧化物层,多晶硅层,氮化物层和介电层。

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