HIGHLY HEAT CONDUCTIVE POLYIMIDE FILM, HIGHLY HEAT CONDUCTIVE METAL-CLAD LAMINATE, AND METHOD FOR PRODUCING THE SAME

摘要

Provided is a highly heat conductive metal-clad laminate which shows heat resistance, dimensional stability, workability, and adhesiveness and excellent thermal conductivity properties. Also provided is a highly heat conductive polyimide film. The highly heat conductive metal-clad laminate has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length D_L of 0.1-15 μm and a spherical filler with an average particle diameter D_R of 0.05-10 μm, D_L and D_R satisfy the relationship D_LD_R/2, no heat conductive filler of 30 μmor more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.