Preventing access to stub traces on an integrated circuit package

摘要

An integrated circuit (IC) package includes a printed circuit board (PCB) substrate and a plurality of package attachment terminals. The package attachment terminals are used to conduct electrical signals from a die that is attached and bonded onto the PCB substrate. The PCB substrate has a side edge and includes a plurality of electrically-conductive paths. Each one of the plurality of paths includes an electroplated bond pad, a trace, and a stub trace. The die is connected to the bond pad and the trace couples the bond pad to a respective one of the package attachment terminals. The stub trace is used to facilitate the electroplating process. The stub trace extends from the trace and terminates at a distance away from the side edge. The stub trace is not visible from the side of the IC package and therefore prevents access to IC buses on the package.