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Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
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机译:在普通半导体器件中包括数字半导体元件和模拟半导体元件的半导体器件
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摘要
High density mounting and power source sharing are achieved by a digital semiconductor element and an analog semiconductor element provided in a common semiconductor device. A power layer for analog operation is connected to one end of an EBG (Electromagnetic Band Gap) layer, a power layer for digital operation is connected to the other end of the EBG layer, ground terminals for the respective elements are connected to a common ground layer, and a ground layer for separating the power layer for analog operation and the EBG layer from each other is disposed between the power layer for analog operation and the EBG layer. Thereby, high density mounting is achieved along with reducing interference of the power source to an analog chip.
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