METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE MODULE, SEMICONDUCTOR DEVICE CONNECTING DEVICE, SEMICONDUCTOR DEVICE MODULE MANUFACTURING DEVICE, SEMICONDUCTOR DEVICE MODULE
展开▼
机译:制造半导体装置模块的方法,半导体装置连接装置,半导体装置模块制造装置,半导体装置模块
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of forming a semiconductor device module including a number of n semiconductor devices is provided, n being an integer ≥ 2, the method including: providing a substrate (10) coated with a first contact layer (20), having a semiconductor layer (30) formed on the first contact layer, and having a second contact layer (40) formed on the semiconductor layer; and forming a connection of the first contact layer and the second contact layer by forming a number of n-1 conductive paths (50) in a material of the semiconductor layer for connecting the n semiconductor devices.
展开▼