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PROCESS FOR PRODUCING GaN SINGLE-CRYSTAL, GaN THIN-FILM TEMPLATE SUBSTRATE AND GaN SINGLE-CRYSTAL GROWING APPARATUS

机译:GaN单晶,GaN薄膜薄膜基体和GaN单晶生长装置的生产方法

摘要

Provided are a manufacturing method of a GaN single crystal in which the film thickness of the GaN single crystal can be controlled accurately, even when a hydride vapor phase epitaxy is applied; a GaN thin film template substrate which is suitable for growing a GaN thick film with a fine property; and a GaN single crystal growing apparatus. Provided is a manufacturing method of a GaN single crystal by a hydride vapor phase epitaxy, wherein the hydride vapor phase epitaxy comprises: spraying HCl (hydrogen chloride) onto Ga (gallium) which is heated and fused in a predetermined temperature to generate GaCl (gallium chloride); and forming a GaN thin film by a reaction of the generated GaCl (gallium chloride) with NH3 (ammonia) gas which is hydroxide gas on a substrate, the manufacturing method comprising supplying the NH3 gas in a vicinity of the substrate (for example, at a position which is separated from the substrate by a distance of 0.7-4.0 times as longer than a diameter of the substrate) through a nozzle. Further, as the substrate, an NGO(011) substrate in which the lattice constant thereof is similar to that of GaN is used.
机译:提供一种GaN单晶的制造方法,其中,即使施加氢化物气相外延,也可以准确地控制GaN单晶的膜厚。 GaN薄膜模板基板,适合于生长具有优良特性的GaN厚膜; GaN单晶生长装置。提供了一种通过氢化物气相外延制造GaN单晶的方法,其中,所述氢化物气相外延包括:将HCl(氯化氢)喷射到Ga(镓)上,所述Ga在预定温度下加热并熔融以生成GaCl(镓)。氯化物);通过使所生成的GaCl(氯化镓)与作为氢氧化物气体的NH 3(氨)气体反应在基板上形成GaN薄膜,所述制造方法包括在所述基板附近(例如,在通过喷嘴与基板隔开的距离是基板直径的0.7-4.0倍的距离。此外,作为衬底,使用其晶格常数类似于GaN的晶格常数的NGO(011)衬底。

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