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LEAD-FREE SOLDER FOR VEHICLE, AND IN-VEHICLE ELECTRONIC CIRCUIT

机译:车用无铅焊料和车内电子电路

摘要

A Sn-Ag-Cu-Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder consists essentially of Ag: 2.8 - 4 mass %, Bi: 1.5 - 6 mass %, Cu: 0.8 - 1.2 mass %, and a remainder of Sn.
机译:提供了可用于车载电子电路的焊接并且具有优异的耐热循环性和机械强度的Sn-Ag-Cu-Bi无铅焊料。焊料主要由Ag:2.8-4质量%,Bi:1.5-6质量%,Cu:0.8-1.2质量%和剩余的Sn组成。

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