HEAT DISSIPATING SUBSTRATE, CAPABLE OF IMPROVING HEAT DISSIPATION PERFORMANCE BY LAMINATING A CORE SUBSTRATE WHICH HAS TWO LAYERS WITH A METAL CORE, AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A heat dissipating substrate and a manufacturing method thereof are provided to form a circuit layer by forming an anode oxidation insulating layer in a metal core.;CONSTITUTION: A first core substrate(112a) is formed by laminating a first circuit layer(110a) on a first metal core(102a) which has a first anode oxidation insulating layer(108a). A second core substrate(112b) is electrically connected to the first core substrate. The second core substrate is formed by laminating a second circuit layer(110b) on a second metal core(102b) which has a second anode oxidation insulating layer(108b). A front layer penetration hole is formed by eliminating an insulating member(114) between a first penetration hole and a second penetration hole. A conductive material(120) is inserted into the front layer penetration hole.;COPYRIGHT KIPO 2011