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SEMICONDUCTOR PACKAGE WITH A STRUCTURE CAPABLE OF REDUCING PRODUCTION COSTS BY DECREASING PROCESSES REQUIRED FOR PREPARING REDISTRIBUTION
SEMICONDUCTOR PACKAGE WITH A STRUCTURE CAPABLE OF REDUCING PRODUCTION COSTS BY DECREASING PROCESSES REQUIRED FOR PREPARING REDISTRIBUTION
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机译:具有可通过减少准备再分配的过程来减少生产成本的结构的半导体封装
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摘要
PURPOSE: A semiconductor package is provided to reduce manufacturing processes of a semiconductor package by performing processes for redistribution and a pillar-shaped connection member by a printing method.;CONSTITUTION: A semiconductor package(100) includes: a substrate(10) in which a connection pad(5) is formed; a semiconductor chip(20) including a bonding pad(24) facing the connection pad; and a conductive connect member(30) which electrically connects the bonding pad and the connection pad and includes a binder fixing conductive fillers.;COPYRIGHT KIPO 2011
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