LEAD FRAME CAPABLE OF REDUCING MANUFACTURING COSTS AND THE NUMBER OF PROCESSES AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A lead frame and a method for manufacturing a semiconductor package using the same are provided to remove the back etching part of a lead and the lower part of a chip mounting plate by using a chemical etching process, thereby facilitating individual separation of each lead.;CONSTITUTION: A semiconductor chip(20) is mounted on a chip mounting plate(12). A tie bar connects a side frame to a chip mounting plate. Leads(14) are extended from the side frame and connected to the four sides of the chip mounting plate. A first down set part(15) and a second down set part(16) are formed in the tie bar and the leads. A wire bonding face(17) is formed in the region between the first down set part and the second down set part. A back etching part(18) is exposed to the outside by using molding compound resin(24).;COPYRIGHT KIPO 2013