LEAD FRAME, A SEMICONDUCTOR PACKAGE, AND A MANUFACTURING METHOD THEREOF, CAPABLE OF REDUCING MANUFACTURING COSTS

摘要

PURPOSE: A lead frame, a semiconductor package, and a manufacturing method thereof are provided to freely add a lead to any positions by easily changing the design of the lead frame.;CONSTITUTION: A lead frame includes an adhesive tape(102), a chip pad(104), and a lead(106). The chip pad is adhered on the adhesive tape. The lead is adhered on the adhesive tape and is positioned on the outer side of the chip pad. The chip pad and the lead are individually separated.;COPYRIGHT KIPO 2011