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A MODULAR BIPOLAR-CMOS-DMOS ANALOG INTEGRATED CIRCUIT AND POWER TRANSISTOR TECHNOLOGY

机译:模块化双极CMOS-DMOS模拟集成电路和功率晶体管技术

摘要

Family's semiconductor devices is formed in the semiconductor substrate without containing epitaxial layer. In one embodiment, which includes 5V CMOS couple, 12V CMOS couple, 5V NPN, 5V PNP, lateral trench MOSFET, the 30V transverse direction n- channels DMOS of several forms. Each device, and can be completely and in all other device substrate laterally and vertically very compact.
机译:Family的半导体器件在不包含外延层的半导体衬底中形成。在一个实施例中,其包括5V CMOS对,12V CMOS对,5V NPN,5V PNP,横向沟槽MOSFET,几种形式的30V横向n沟道DMOS。每个器件,在整个和所有其他器件的基板上,在横向和垂直方向上都非常紧凑。

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