METHOD FOR MANUFACTURING FLIP-CHIP MICRO BUMPS, CAPABLE OF PREVENTING THE GENERATION OF A BUMP-BRIDGE PHENOMENON DUE TO THE DAMAGE OF SOLAR PASTE

摘要

PURPOSE: A method for manufacturing flip-chip micro bumps is provided to previously prevent the defects of solder bumps by implementing successively a solder paste printing process, a drying process, a photo-resist material layer releasing process, and a reflow process.;CONSTITUTION: A complex resist layer(Q) including a photo-resist material layer(130) is formed on the upper side of a core layer(110). A bump-hole region(R) is formed on the complex resist layer. Solder paste(140) is applied to the bump-hole region. The photo-resist material layer is released from the core layer after the solder paste is dried. The core layer with solder paste is undergone a reflow process.;COPYRIGHT KIPO 2011