PRINT CIRCUIT BOARD HAVING EXCELLENT HEAT DISSIPATING AND HEAT SPREAD AND LIGHT EMITTING DIODE MODULE USING THEREOF

摘要

PURPOSE: A printed circuit board with the superior heat dissipation and a heat diffusivity improving the thermal conductance and the light emitting module using same are provided to extend the lifetime of the emitting device using the printed circuit board effectively decentralizing the heat generated in the emitting device. CONSTITUTION: The base plate is included of the aluminum. It is formed in the top and lower part of the main metal layer and the heat dissipation resin layer(12) is included of the epoxy composite. It is formed at the lower part of the lower part heat dissipation resin layer and the protective layer(13) is included of the polyester composition.