Print Circuit Board Having Excellent Heat Dissipating and Heat Spread and Light Emitting Diode Module Using Thereof

摘要

The present invention relates to a light emitting device module including a printed circuit board and a printed circuit board having excellent heat dissipation and thermal diffusivity (dispersibility) including aluminum as a main metal layer and a heat dissipating resin layer and a protective layer made of an epoxy composition. The present invention is a base plate made of aluminum (Al), the heat radiation resin layer made of an epoxy composition on the upper and lower portions of the base plate, the lower heat radiation resin layer formed under the protective layer made of a polyester composition, and the upper heat radiation resin layer A heat dissipation printed circuit board comprising a copper layer for wiring bonded with an adhesive layer is provided. The heat dissipation printed circuit board of the present invention is excellent in heat dissipation, heat resistance, and corrosion resistance, and when applying an LED or a LED package as a light emitting device, it is possible to quickly and effectively dissipate heat generated from the light emitting device to extend the life of the light emitting device.;Aluminum, heat dissipation metal layer, heat dissipation resin layer, light emitting device module, thermal diffusivity, heat dissipation