ULTRASONIC HORN WITH BONDING UNITS AND AN APPARATUS FOR BONDING A FLIP CHIP

摘要

PURPOSE: An ultrasonic horn and an apparatus for bonding a flip chip are provided to bond a chip with a substrate by rotating a bonding unit, thereby increasing work speed.;CONSTITUTION: An ultrasonic horn comprises a main body unit, a plurality of bonding units, and a plurality of pneumatic passages. A plurality of bonding units(220) are formed on at least two side parts of the main body unit and include at least pneumatic hole. The pneumatic passages are formed in the main body unit and connect each pneumatic hole of a bonding unit is connected to one side of the main body unit. A holder unit(310) supports the ultrasonic horn. A vibrator(320) is combined with one end of the ultrasonic horn.;COPYRIGHT KIPO 2011